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AGC Multi Material America to Participate in PCB West Exhibition :: I-Connect007

New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence? 

A solid strategy is a critical part of success. This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies. Ic Pcb Board

AGC Multi Material America to Participate in PCB West Exhibition  :: I-Connect007

In this issue, we explore how TQM has entered the DNA of continuous improvement disciplines, and the role leadership transformation plays in this. If you've ever competed against a TQM company, you understand their winning advantage.

Estimated reading time: Less then a minute

AGC Multi Material America is participating in the PCB West Exhibition in Santa Clara, California on September 20, 2023.

Visit us at Booth 305 to learn more about AGC Multi Material’s comprehensive material offering. Ask about fastRise bondply materials, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.

AGC Multi Material America to Participate in PCB West Exhibition  :: I-Connect007

Printed Wiring Assembly PCB West is the largest conference and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley.